Resin coated copper capacitive (RC3) nanocomposites for multilayer embedded capacitors: towards system in a package (SiP)

Author： Das Rabindra N. Rosser Steven G. Papathomas Konstantinos I. Antesberger Tim Markovich Voya R.

Publisher： Emerald Group Publishing Ltd

ISSN： 0305-6120

Source： Circuit World, Vol.35, Iss.4, 2009-11, pp. : 31-39

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