Author： Sheats Jayna R. Biesty David Noel Julien Taylor Gary N.
Publisher： Emerald Group Publishing Ltd
ISSN： 0305-6120
Source： Circuit World, Vol.36, Iss.2, 2010-01, pp. : 40-47
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Asian Electronics and PWB Production, Market and Technology
By Nakahara H.
Circuit World, Vol. 20, Iss. 3, 1993-12 ,pp. :
Access to resources
Recommend
Surface Mount Technology in Japan—From Consumer Electronics to Supercomputer
By Nakahara H.
Circuit World, Vol. 13, Iss. 3, 1993-12 ,pp. :
Electronics Packaging Technology Update: BGA, CSP, DCA and Flip Chip
By Lau J H
Circuit World, Vol. 23, Iss. 4, 1997-04 ,pp. :