Physical modeling, theoretical analysis, and experimental test of via holes in microwave planar circuits

Author: Tian Yu   Tong Ling  

Publisher: Emerald Group Publishing Ltd

ISSN: 0332-1649

Source: COMPEL: Int J for Computation and Maths. in Electrical and Electronic Eng., Vol.29, Iss.2, 2010-03, pp. : 545-562

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Abstract