Microstructurally Based Finite Element Simulation on Solder Joint Behaviour*

Author: Frear D.R.   Burchett S.N.   Neilsen M.K.   Stephens J.J.  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.9, Iss.1, 1997-01, pp. : 39-42

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Abstract