Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments

Author： Zeng Guang Xue Songbai Zhang Liang Sheng Zhong Gao Lili

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.22, Iss.4, 2010-09, pp. : 57-64

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