Failure mechanism of solder bubbles in PCB vias during high-temperature assembly

Author： Chen Yuanming   He Wei   Zhou Guoyun   Tao Zhihua   Wang Yang   Luo Daojun  

Publisher： Emerald Group Publishing Ltd

ISSN： 0305-6120

Source： Circuit World, Vol.39, Iss.3, 2013-08, pp. : 133-138

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

The constraints of vias and layers and their impact on PCB design strategy

By Palmer P.J.   Williams D.J.  

Circuit World, Vol. 25, Iss. 4, 1999-04 ,pp. : 22-24

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Implementing solid solder deposits (SSDs) in PCB manufacture

By DeBlis J  

Circuit World, Vol. 28, Iss. 1, 2002-10 ,pp. : 10-14

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

The Importance of Cleaning Equipment in PCB Assembly

By Lambert W.  

Circuit World, Vol. 9, Iss. 3, 1993-12 ,pp. : 32-33

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Optimizing BGA to PCB interconnections using multi-depth laser drilled blind vias-in-pad

By Burgess Larry W   Pauri Fabrizio  

Circuit World, Vol. 25, Iss. 2, 1999-02 ,pp. : 31-34

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

High-temperature piezoelectric crystals and devices

By Fritze Holger  

Journal of Electroceramics, Vol. 26, Iss. 1-4, 2011-06 ,pp. : 122-161

Springer Publishing Company

Access to resources Recommend Favorite