Author: Monkman Gareth J.
Publisher: Emerald Group Publishing Ltd
ISSN: 0260-2288
Source: Sensor Review, Vol.19, Iss.4, 1999-12, pp. : 273-277
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Assessing building façades using infra-red thermography
By Chew M.Y.L.
Structural Survey, Vol. 16, Iss. 2, 1998-02 ,pp. :
Infra-red signature reduction study on a small-scale jet engine
The Aeronautical Journal, Vol. 109, Iss. 1092, 2005-02 ,pp. :
Reflow flip-chip bonding technology for infrared detectors
Journal of Micromechanics and Microengineering, Vol. 25, Iss. 8, 2015-01 ,pp. :