Productionisation issues for commercialisation of microfluidic based devices

Author： Webb Dennis Patrick Knauf Benedikt Liu Chanqing Hutt David Conway Paul

ISSN： 0260-2288

Source： Sensor Review, Vol.29, Iss.4, 2009-09, pp. : 349-354

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Abstract

Purpose ‐ Microfluidic or "lab-on-a-chip" technology is seen as a key enabler in the rapidly expanding market for medical point-of-care and other kinds of portable diagnostic device. The purpose of this paper is to discuss two proposed packaging processes for large-scale manufacture of microfluidic systems. Design/methodology/approach ‐ In the first packaging process, polymer overmoulding of a microfluidic chip is used to form a fluidic manifold integrated with the device in a single step. The anticipated advantages of the proposed method of packaging are ease of assembly and low part count. The second process involves the use of low-frequency induction heating (LFIH) for the sealing of polymer microfluidics. The method requires no chamber, and provides fast and selective heating to the interface to be joined. Findings ‐ Initial work with glass microfluidics demonstrates feasibility for overmoulding through two separate sealing principles. One uses the overmould as a physical support structure and providing sealing using a compliant ferrule. The other relies on adhesion between the material of the overmould and the microfluidic device to provide a seal. As regards LFIH work on selection and structuring of susceptor materials is reported, together with analysis of the dimensions of the heat-affected zone. Acrylic plates are joined using a thin (<>µm) nickel susceptor providing a fluid seal that withstands a pressure of 590?kPa. Originality/value ‐ Microfluidic chips have until now been produced in relatively small numbers. To scale-up from laboratory systems to the production volumes required for mass markets, packaging methods need to be adapted to mass manufacture.