A novel high performance die attach

Author: Xie X.M.   Wang T.B.   Shi J.Z.   Ye R.Q.   Stubhan F   Freytag J  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.12, Iss.1, 2000-01, pp. : 40-44

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Abstract