Pb-free solder bumping for flip chip package by electroplating

By Hwang Hyeon   Hong Soon-Min   Jung Jae-Pil   Kang Choon-Sik  

Soldering & Surface Mount Technology, Vol. 15, Iss. 2, 2003-06 ,pp. : 10-16

Emerald Group Publishing Ltd

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Enhanced solder wettability of oxidized-copper with lead-free solder via Ar-H2 plasmas for flip-chip bumping: the effects of H2 flow rates

By Lin Y.S.   Lin W.J.   Chiu L.Y.  

Soldering & Surface Mount Technology, Vol. 24, Iss. 3, 2012-06 ,pp. : 183-190

Emerald Group Publishing Ltd

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Optimisation modelling for flip-chip solder joint reliability

By Stoyanov S   Bailey C   Cross M  

Soldering & Surface Mount Technology, Vol. 14, Iss. 1, 2002-01 ,pp. : 49-58

Emerald Group Publishing Ltd

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Novel Deprocessing Technique for Failure Analysis of Flip-Chip Integrated Circuit Packages

By Marks M.R.  

Practical Failure Analysis, Vol. 1, Iss. 6, 2001-12 ,pp. : 45-52

Springer Publishing Company

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Flip chip solder joint reliability under harsh environment

By Bo Cheng   Li Wang   Qun Zhang   Xia Gao   Xiaoming Xie   Kempe Wolfgang  

Soldering & Surface Mount Technology, Vol. 15, Iss. 3, 2003-12 ,pp. : 15-20

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