Optimisation modelling for flip-chip solder joint reliability

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Emerald Group Publishing Ltd

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The beneficial effect of underfilling on the reliability of flip-chip joints

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Optimisation modelling for thermal fatigue reliability of lead-free interconnects in fine-pitch flip-chip packaging

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Degradation of flip-chip-on-glass interconnection with ACF under high humidity and thermal aging

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Investigation of a solder bumping technique for flip-chip interconnection

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