The effect of lead-free solder paste on component placement accuracy and self-alignment during reflow

By Liukkonen Timo   Nummenpää Pekka   Tuominen Aulis  

Soldering & Surface Mount Technology, Vol. 16, Iss. 1, 2004-02 ,pp. : 44-47

Emerald Group Publishing Ltd

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Heated Gas Jet Reflow: An Alternative Reflow Solder Assembly Process Technology*

By Lichtenberg L R   Gillespie P J  

Soldering & Surface Mount Technology, Vol. 9, Iss. 1, 1997-01 ,pp. : 13-16

Emerald Group Publishing Ltd

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Reflow profile study of the Sn-Ag-Cu solder

By Salam B   Virseda C   Da H   Ekere N.N.   Durairaj R  

Soldering & Surface Mount Technology, Vol. 16, Iss. 1, 2004-02 ,pp. : 27-34

Emerald Group Publishing Ltd

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Critical factors affecting paste flow during the stencil printing of solder paste

By Durairaj R   Nguty T.A.   Ekere N.N.  

Soldering & Surface Mount Technology, Vol. 13, Iss. 2, 2001-04 ,pp. : 30-34

Emerald Group Publishing Ltd

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A study of solder paste printing requirements for CSP technology

By Kennedy Jeff  

Soldering & Surface Mount Technology, Vol. 12, Iss. 3, 2000-12 ,pp. : 13-19

Emerald Group Publishing Ltd

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