CSP compatibility in the SMT assembly process

By Chen L Alex   Sterian Irene   Smith Brian   Kirkpatrick Damien  

Soldering & Surface Mount Technology, Vol. 11, Iss. 2, 1999-02 ,pp. : 25-29

Emerald Group Publishing Ltd

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Numerical modelling of scanned beam laser soldering of fine pitch packages

By Beckett P.M.   Fleming A.R.   Gilbert J.M.   Whitehead D.G.  

Soldering & Surface Mount Technology, Vol. 14, Iss. 1, 2002-01 ,pp. : 24-29

Emerald Group Publishing Ltd

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Sub process challenges in ultra fine pitch stencil printing of type-6 and type-7 Pb-free solder pastes for flip chip assembly applications

By Jackson G.J.   Hendriksen M.W.   Kay R.W.   Desmulliez M   Durairaj R.K.   Ekere N.N.  

Soldering & Surface Mount Technology, Vol. 17, Iss. 1, 2005-01 ,pp. : 24-32

Emerald Group Publishing Ltd

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Evaluation of pre-deposited (no-flow) underfill for flip chip and CSP assembly

By Firmstone M.G.   Bartholomew P.M.   Lowrie D.J.J.   Mannan S.H.   Hutt D.A.  

Soldering & Surface Mount Technology, Vol. 11, Iss. 1, 1999-01 ,pp. : 8-12

Emerald Group Publishing Ltd

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Design, materials and process for lead-free assembly of high-density packages

By Smetana Joe   Horsley Rob   Lau John   Snowdon Ken   Shangguan Dongkai   Gleason Jerry   Memis Irv   Love Dave   Dauksher Walter   Sullivan Bob  

Soldering & Surface Mount Technology, Vol. 16, Iss. 1, 2004-02 ,pp. : 53-62

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