Design, materials and process for lead-free assembly of high-density packages

Author： Smetana Joe   Horsley Rob   Lau John   Snowdon Ken   Shangguan Dongkai   Gleason Jerry   Memis Irv   Love Dave   Dauksher Walter   Sullivan Bob  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.16, Iss.1, 2004-02, pp. : 53-62

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