A novel crack and delamination protection mechanism for a WLCSP using soft joint technology

Author: Yew Ming-Chih   Chiu Chien-Chia   Chang Shu-Ming   Chiang Kuo-Ning  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.18, Iss.3, 2006-07, pp. : 3-13

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Abstract