Soldering & Surface Mount Technology,volume 18,issue 3  (07-2015)

Period of time: 2015年3期

Publisher: Emerald Group Publishing Ltd

Founded in: 1981

Total resources: 58

ISSN: 0954-0911

Subject: TF Metallurgical Industry

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Soldering & Surface Mount Technology,volume 18,issue 3

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Minimizing flux spatter during lead-free reflow assembly

By Manjunath Deepak,Iyer Satyanarayan,Eckel Shawn,Damodaran Purushothaman,Srihari Krishnaswami in (2006)

Soldering & Surface Mount Technology,volume 18,issue 3 , Vol. 18, Iss. 3, 2006-07 , pp. 19-23

Emerald Group Publishing Ltd

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