Period of time: 2015年3期
Publisher: Emerald Group Publishing Ltd
Founded in: 1981
Total resources: 58
ISSN: 0954-0911
Subject: TF Metallurgical Industry
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Soldering & Surface Mount Technology,volume 18,issue 3
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A novel crack and delamination protection mechanism for a WLCSP using soft joint technology
By Yew Ming-Chih,Chiu Chien-Chia,Chang Shu-Ming,Chiang Kuo-Ning in (2006)
Soldering & Surface Mount Technology,volume 18,issue 3 , Vol. 18, Iss. 3, 2006-07 , pp.Learning from the migration to lead-free solder
By Ciocci Richard,Pecht Michael in (2006)
Soldering & Surface Mount Technology,volume 18,issue 3 , Vol. 18, Iss. 3, 2006-07 , pp.Minimizing flux spatter during lead-free reflow assembly
By Manjunath Deepak,Iyer Satyanarayan,Eckel Shawn,Damodaran Purushothaman,Srihari Krishnaswami in (2006)
Soldering & Surface Mount Technology,volume 18,issue 3 , Vol. 18, Iss. 3, 2006-07 , pp.Dissolution of stainless steels in molten lead-free solders
By Takemoto Tadashi,Takemoto Masaharu in (2006)
Soldering & Surface Mount Technology,volume 18,issue 3 , Vol. 18, Iss. 3, 2006-07 , pp.By Hillman D.D.,Chumbley L.S. in (2006)
Soldering & Surface Mount Technology,volume 18,issue 3 , Vol. 18, Iss. 3, 2006-07 , pp.