Author: Li Chunyuan Wang Xitao Yuan Wenxia
Publisher: Emerald Group Publishing Ltd
ISSN: 0954-0911
Source: Soldering & Surface Mount Technology, Vol.21, Iss.2, 2009-04, pp. : 4-8
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Investigation of Copper-Silver Solders Properties in Liquid State before Amorphization
Key Engineering Materials, Vol. 2015, Iss. 660, 2015-09 ,pp. :
Properties of SnZn lead free solders bearing rare earth Y
By Zhang L Han J-G Guo Y-H He C-W
Science and Technology of Welding & Joining, Vol. 17, Iss. 5, 2012-07 ,pp. :