Development of a lead-free solder: Sn-4.0Bi-3.7Ag-0.9Zn

Author： Wang Xun   Liu Yongchang   Yu Liming   Dong Zhizhong   Gao Zhiming  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.23, Iss.1, 2011-02, pp. : 15-21

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