Period of time： 2015年1期
Publisher： Emerald Group Publishing Ltd
Founded in： 1981
Total resources： 58
ISSN： 0954-0911
Subject： TF Metallurgical Industry
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Soldering & Surface Mount Technology,volume 23,issue 1
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Effects of bulk Cu 6 Sn 5 intermetallic compounds on the properties of Sn-Ag-Cu-Ce soldered joints
By Zhang Liang,Xue Song-bai,Gao Li-li,Sheng Zhong,Dai Wei,Ji Feng,Ye Huan,Chen Yan,Yu Sheng-lin in (2011)
Soldering & Surface Mount Technology,volume 23,issue 1 , Vol. 23, Iss. 1, 2011-02 , pp.
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