The solder paste printing process: critical parameters, defect scenarios, specifications, and cost reduction

Author: Huang Chien-Yi   Lin Yueh-Hsun   Ying Kuo-Ching   Ku Chen-Liang  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.23, Iss.4, 2011-09, pp. : 211-223

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Abstract