Evaluation of the influence of Bi and Sb additions to Sn-Ag-Cu and Sn-Zn alloys on their surface tension and wetting properties using analysis of variance ‐ ANOVA

By Bukat K.   Sitek J.   Kisiel R.   Moser Z.   Gasior W.   Koscielski M.   Pstrus J.  

Soldering & Surface Mount Technology, Vol. 20, Iss. 4, 2008-09 ,pp. : 9-19

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments

By Zeng Guang   Xue Songbai   Zhang Liang   Sheng Zhong   Gao Lili  

Soldering & Surface Mount Technology, Vol. 22, Iss. 4, 2010-09 ,pp. : 57-64

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Ag₃Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu

By Kang Sung   Shih Da-Yuan   Donald NY.   Henderson W.   Gosselin Timothy   Sarkhel Amit   Charles Goldsmith NY.   Puttlitz Karl   Choi Won  

JOM, Vol. 55, Iss. 6, 2003-06 ,pp. : 61-65

Springer Publishing Company

Access to resources Recommend Favorite

Controlling Ag₃Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying

By Kang Sung   Shih Da-Yuan   Leonard Donovan   Henderson Donald   Gosselin Timothy   Cho Sung-il   Yu Jin   Choi Won  

JOM, Vol. 56, Iss. 6, 2004-06 ,pp. : 34-38

Springer Publishing Company

Access to resources Recommend Favorite

Statistical analysis of stencil technology for wafer-level bumping

By Kay Robert W.   Cummins Gerard   Krebs Thomas   Lathrop Richard   Abraham Eitan   Desmulliez Marc  

Soldering & Surface Mount Technology, Vol. 26, Iss. 2, 2014-04 ,pp. : 71-78

Emerald Group Publishing Ltd

Access to resources Recommend Favorite