Author: Firmstone M G Bartholomew P M Paterson G Dietz** R Robinson** P
Publisher: Emerald Group Publishing Ltd
ISSN: 1356-5362
Source: Microelectronics International, Vol.14, Iss.2, 1997-02, pp. : 16-21
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
An Innovation in Thermoplastic, Reworkable Adhesive Pastes*
Microelectronics International, Vol. 13, Iss. 1, 1996-01 ,pp. :
Substrate integrated packaging for RF-applications
By Richter H Ferling D Buchali F Heck W
Microelectronics International, Vol. 17, Iss. 1, 2000-01 ,pp. :