An evaluation of materials and processes employed in the construction of novel thick film force sensors

Author： Zheng Yulan Atkinson John Zhang Zhige Sion Russ

ISSN： 1356-5362

Source： Microelectronics International, Vol.20, Iss.1, 2003-01, pp. : 31-33

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Measurement techniques for the evaluation of thick-film materials used in wireless applications

By Tian Zhengrong Free Charles

Microelectronics International, Vol. 18, Iss. 2, 2001-05 ,pp. : 21-25

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

FLAT TYPE THICK FILM INDUCTIVE SENSORS

By MARIOLI D. SARDINI E. TARONI A.

Active and Passive Electronic Components, Vol. 26, Iss. 1, 2003-01 ,pp. : 37-49

Taylor & Francis Ltd

Access to resources Recommend Favorite

Thick-film strain and temperature sensors on LTCC substrates

By Hrovat Marko Belavic Darko Kita Jaroslaw Holc Janez Drnov?ek Silvo Cilen?ek Jena Golonka Leszek Dziedzic Andrzej

Microelectronics International, Vol. 23, Iss. 3, 2006-09 ,pp. : 33-41

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Silicon pressure sensors with a thick film periphery

By Belaviˇc Darko ˇSoba Stojan Pavlin Marko Roˇcak Dubravka Hrovat Marko

Microelectronics International, Vol. 15, Iss. 3, 1998-03 ,pp. : 26-30

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Volume air flow sensors based on NTC thick film segmented thermistors

By Obrad S. Aleksic Pantelija Nikolic M. Konstantinos Paraskevopoulos M.

Microelectronics International, Vol. 23, Iss. 3, 2006-09 ,pp. : 14-18

Emerald Group Publishing Ltd

Access to resources Recommend Favorite