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Microelectronics Reliability, Vol. 44, Iss. 2, 2004-02 ,pp. : 275-285

Elsevier

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Effects of mechanical stress at no current stressed area on electromigration reliability of multilevel interconnects

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Microelectronic Engineering, Vol. 71, Iss. 1, 2004-01 ,pp. : 76-89

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Evaluation of ultra-low-k dielectric materials for advanced interconnects

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