Optimization of reflow soldering process for BGA packages by artificial neural network

Author: Lin Yu-Hsin   Deng Wei-Jaw   Shie Jie-Ren   Yang Yung-Kuang  

Publisher: Emerald Group Publishing Ltd

ISSN: 1356-5362

Source: Microelectronics International, Vol.24, Iss.2, 2007-04, pp. : 64-70

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Abstract