Temperature cycling analysis for ball grid array package using finite element analysis

Author: Zulkifli Muhammad Nubli   Jamal Zul Azhar Zahid   Quadir Ghulam Abdul  

Publisher: Emerald Group Publishing Ltd

ISSN: 1356-5362

Source: Microelectronics International, Vol.28, Iss.1, 2011-01, pp. : 17-28

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Abstract