Design-for-reliability implementation in microelectronics packaging development

Author： Yang Liyu   Niu Rui   Xie Jinsong   Qian Bin   Song Baishi   Rong Qingan   Bernstein Joseph  

Publisher： Emerald Group Publishing Ltd

ISSN： 1356-5362

Source： Microelectronics International, Vol.28, Iss.1, 2011-01, pp. : 29-40

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