A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low-Ag Sn-Ag-Cu solder joints

Author： Shnawah Dhafer Abdul Ameer   Sabri Mohd Faizul Bin Mohd   Badruddin Irfan Anjum   Said Suhana  

Publisher： Emerald Group Publishing Ltd

ISSN： 1356-5362

Source： Microelectronics International, Vol.29, Iss.1, 2012-01, pp. : 47-57

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