Study on deformation conditions of epoxy compounds for semiconductor integrated circuits

Author： Saiki H.   Nishitake H.   Marumo Y.   Sakamoto H.   Hazama M.   Sakata F.  

Publisher： Inderscience Publishers

ISSN： 1741-8410

Source： International Journal of Microstructure and Materials Properties, Vol.2, Iss.2, 2007-06, pp. : 214-223

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