The development of a wire saw for wafer slicing of single-crystal silicon

Author: Hou Z.J.   Ge P.Q.   Gao Y.F.  

Publisher: Inderscience Publishers

ISSN: 0952-8091

Source: International Journal of Computer Applications in Technology, Vol.29, Iss.2-4, 2007-09, pp. : 187-190

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Abstract