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Maney Publishing

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Effects of liquid–liquid transition on solidification of Sb–10 wt-%Cu alloy

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Influence of solder thickness on interfacial structures and fatigue properties of Cu/Sn/Cu joints

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Compressive failure of alumina continuous fibre reinforced Al–4·5 wt-%Cu alloy at elevated temperatures

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Effect of Mn on Sn–Ag–Cu ternary lead free solder alloy–Cu assembly: a comparative study

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