Reactive diffusion bonding of SiCp/Al composites by insert layers of mixed powders

Author： Huang J. H.   Dong Y. L.   Wan Y.   Zhang J. G.   Zhou G. A.  

Publisher： Maney Publishing

ISSN： 1743-2847

Source： Materials Science and Technology, Vol.21, Iss.10, 2005-10, pp. : 1217-1221

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