Microstructural and textural analyses of flip chip bonded gold by orientation mapping

Author： Yang P.   Li C. M.   Liu D. M.   Hung M.   Li M.   Meng L.  

Publisher： Maney Publishing

ISSN： 1743-2847

Source： Materials Science and Technology, Vol.21, Iss.12, 2005-12, pp. : 1444-1449

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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