Correlation between displacement rate and shear force in shear test of Sn–Pb and lead free solder joints

Author： Kim J.-W.   Joo J.   Quesnel D. J.   Jung S.-B.  

Publisher： Maney Publishing

ISSN： 1743-2847

Source： Materials Science and Technology, Vol.21, Iss.3, 2005-03, pp. : 373-380

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