Author: Mosallaee M. Ekrami A. Ohsasa K. Matsuura K.
Publisher: Maney Publishing
ISSN: 1743-2847
Source: Materials Science and Technology, Vol.24, Iss.4, 2008-04, pp. : 449-456
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Abstract
Redistribution of alloying elements in the transient liquid phase (TLP) bonding zone of IN738LC/BNi-3/IN738LC was studied to investigate microstructural evolution in this area. Wavelength dispersive spectrometry and electron probe microanalysis revealed that, during non-isothermal solidification in the TLP bonding zone, enrichment of residual liquid phase with the positive segregating elements caused formation of intermetallic in the bonding zone. Scanning electron microscopy observation indicated that the redistribution of alloying elements, between TLP bonding zone and base alloy, resulted in formation of a
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