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By Lee H. T.   Huang W. Y.   Chen Y. F.  

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Maney Publishing

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In situ observation of nucleation, fragmentation and microstructure evolution in Sn–Bi and Al–Cu alloys

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Effects of Pb contamination on the eutectic Sn-Ag solder joint

By Choi S   Bieler T.R.   Subramanian K.N.   Lucas J.P.  

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Understanding the effects of addition of copper nanoparticles to Sn-3.5 Ag solder

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The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder

By Ochoa F.   Williams J.   Chawla N.  

JOM, Vol. 55, Iss. 6, 2003-06 ,pp. : 56-60

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