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Emerald Group Publishing Ltd

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The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder

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JOM, Vol. 55, Iss. 6, 2003-06 ,pp. : 56-60

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Silver nanoparticles effect on the wettability of Sn-Ag-Cu solder pastes and solder joints microstructure on copper

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Influence of copper addition on adhesive strength of Sn–3Ag–1·5Sb solder joints

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Science and Technology of Welding & Joining, Vol. 9, Iss. 6, 2004-12 ,pp. : 555-559

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Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing

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