Morphology and chemical composition of Cu/Sn/Cu and Cu(5 at-%Ni)/Sn/Cu(5 at-%Ni) interconnections

Author： Wierzbicka-Miernik A   Wojewoda-Budka J   Litynska-Dobrzynska L   Kodentsov A   Zieba P  

Publisher： Maney Publishing

ISSN： 1743-2936

Source： Science and Technology of Welding & Joining, Vol.17, Iss.1, 2012-01, pp. : 32-35

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