A comparative study of microstructure and mechanical properties among Cu/Sn/Cu, Ni/Sn/Ni and Cu/Sn/Ni solder joints

Author： Wang Bo   Wu Fengshun   Wu Yiping   An Bing   Liu Hui   Zou Jian  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.23, Iss.1, 2011-02, pp. : 40-46

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