Laser treatment of silicon at nitrogen ambient: thermal stress analysis

ISSN： 1743-2944

Source： Surface Engineering, Vol.27, Iss.6, 2011-07, pp. : 436-444

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Laser nitriding of tool steel: thermal stress analysis

By Yilbas Bekir Arif A. Karatas C. Akhtar S. Aleem B.

The International Journal of Advanced Manufacturing Technology, Vol. 49, Iss. 9-12, 2010-08 ,pp. : 1009-1018

Springer Publishing Company

Access to resources Recommend Favorite

Differential thermal analysis of porous silicon

By Nechitaylov A. Glebova N.

Russian Journal of Applied Chemistry, Vol. 82, Iss. 11, 2009-11 ,pp. : 1928-1933

MAIK Nauka/Interperiodica

Access to resources Recommend Favorite

THERMAL ANALYSIS OF LASER HEAT TREATED ENGINEERING ALLOYS

By Yilbas B. S. Shuja S. Z. Sami M.

Surface Engineering, Vol. 13, Iss. 2, 1997-01 ,pp. : 149-156

Maney Publishing

Access to resources Recommend Favorite

Thermal stress developed during the laser cutting process: consideration of different materials

By Arif A. Yilbas Bekir

The International Journal of Advanced Manufacturing Technology, Vol. 37, Iss. 7-8, 2008-06 ,pp. : 698-704

Springer Publishing Company

Access to resources Recommend Favorite

PECVD low stress silicon nitride analysis and optimization for the fabrication of CMUT devices

Journal of Micromechanics and Microengineering, Vol. 25, Iss. 1, 2015-01 ,pp. : 15012-15023

IOP Publishing

Access to resources Recommend Favorite