Author： Marshall J.L. Miiller D.E. Sees J. Matteson S.E. Weathers D. Lichtenberg L.
Publisher： Emerald Group Publishing Ltd
ISSN： 0305-6120
Source： Circuit World, Vol.18, Iss.1, 1993-12, pp. : 17-21
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Abstract
A combination of analytical methods was used on printed circuit board coupons to conclude the following: (1) while steam ageing deteriorates solderability of tinned coupons, it does not increase the oxide thickness or tin-lead ratio of the surface (top 50 Angstroms) of tinned coupons; (2) therefore, some other factor, probably oxidation of the copper or tin/copper intermetallic substrate, determines solderability of the coupons.
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