Author： Marshall J.L. Miiller D.E. Sees J. Matteson S.E. Weathers D. Lichtenberg L.
Publisher： Emerald Group Publishing Ltd
ISSN： 0305-6120
Source： Circuit World, Vol.18, Iss.1, 1993-12, pp. : 17-21
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Providing Solderability Retention by means of Chemical Inhibitors
By Bakszt M.
Circuit World, Vol. 11, Iss. 2, 1993-12 ,pp. :
Access to resources
Recommend
Assuring PCB Shelf Life Solderability by Air Levelling
By Keller J.
Circuit World, Vol. 5, Iss. 1, 1993-12 ,pp. :
Quality Assessment: 15—Component Lead Solderability
Circuit World, Vol. 6, Iss. 1, 1993-12 ,pp. :
Real-time control of advanced solderability preservatives
Circuit World, Vol. 24, Iss. 2, 1998-02 ,pp. :
Intermetallic compound formation and solderability for immersion tin
By Chan C.M. Tong K.H. Kwok R.W.M.
Circuit World, Vol. 32, Iss. 4, 2006-12 ,pp. :