Analytical and Experimental Studies of 208-pin Fine Pitch (0·5 mm) Quad Flat Pack Solder-joint Reliability

Author： Lau J.   Dody G.   Chen W.   McShane M.   Rice D.   Erasmus S.   Adamjee W.  

Publisher： Emerald Group Publishing Ltd

ISSN： 0305-6120

Source： Circuit World, Vol.18, Iss.2, 1993-12, pp. : 13-19

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