Plastic Encapsulated MCM Technology for High Volume, Low Cost Electronics

Author: Fillion R.   Wojnarowski R.   Gorcyzca T.   Wildi E.   Cole H.  

Publisher: Emerald Group Publishing Ltd

ISSN: 0305-6120

Source: Circuit World, Vol.21, Iss.2, 1993-12, pp. : 28-31

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Abstract