A low-cost solder-bumped chip scale package -NuCSP

By Lau John H   Chang Chris   Chen Tony   Cheng David   Lao Eric  

Circuit World, Vol. 24, Iss. 3, 1998-03 ,pp. : 11-25

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Design and Procurement of Eutectic Sn/Pb Solder-bumped Flip Chip Test Die and Organic Substrates

By Lau J.   Heydinger M.   Glazer J.   Uno D.  

Circuit World, Vol. 21, Iss. 3, 1993-12 ,pp. : 20-24

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

High volume, low cost flip chip assembly on polyester flex

By Gilleo Ken   Boyes Bob   Corbett Steve   Larson Gary   Price Dave  

Circuit World, Vol. 25, Iss. 2, 1999-02 ,pp. : 11-17

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Are PCB fabricators ready to fabricate MCM-L technology?

By Aziz R  

Circuit World, Vol. 24, Iss. 2, 1998-02 ,pp. : 24-33

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Development of Flip-chip Joining Technology on Flexible Circuitry Using Anistropically Conductive Adhesives and Eutectic Solder*

By Liu J   Boustedt K   Lai Z  

Circuit World, Vol. 22, Iss. 2, 1996-02 ,pp. : 19-24

Emerald Group Publishing Ltd

Access to resources Recommend Favorite