Sub process challenges in ultra fine pitch stencil printing of type-6 and type-7 Pb-free solder pastes for flip chip assembly applications

Author： Jackson G.J. Hendriksen M.W. Kay R.W. Desmulliez M Durairaj R.K. Ekere N.N.

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.17, Iss.1, 2005-01, pp. : 24-32

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

The behaviour of solder pastes in stencil printing with electropolishing process

By Lee Yong-Won Kim Keun-Soo Suganuma Katsuaki

Soldering & Surface Mount Technology, Vol. 25, Iss. 3, 2013-06 ,pp. : 164-174

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

The Development of High Speed Printing Solder Pastes for Fine Pitch Applications*

By M.Warwick Harpley I

Soldering & Surface Mount Technology, Vol. 9, Iss. 2, 1997-02 ,pp. : 29-32

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Pb-free solder bumping for flip chip package by electroplating

By Hwang Hyeon Hong Soon-Min Jung Jae-Pil Kang Choon-Sik

Soldering & Surface Mount Technology, Vol. 15, Iss. 2, 2003-06 ,pp. : 10-16

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Pb-free solders for flip-chip interconnects

By Frear D. Jang J. Lin J. Zhang C.

JOM, Vol. 53, Iss. 6, 2001-06 ,pp. : 28-33

Springer Publishing Company

Access to resources Recommend Favorite

Fine pitch stencil printing using enclosed printing systems

By Zou Ling Chunxian Dusek Milos Wickham Martin Hunt Christopher

Soldering & Surface Mount Technology, Vol. 15, Iss. 1, 2003-02 ,pp. : 43-49

Emerald Group Publishing Ltd

Access to resources Recommend Favorite