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Emerald Group Publishing Ltd

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Pb-free solders for flip-chip interconnects

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Sub process challenges in ultra fine pitch stencil printing of type-6 and type-7 Pb-free solder pastes for flip chip assembly applications

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Lead-free solder joint reliability estimation of flip chip package using FEM-based sensitivity analysis

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Enhanced solder wettability of oxidized-copper with lead-free solder via Ar-H2 plasmas for flip-chip bumping: the effects of H2 flow rates

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