Electrochemical deposition of Copper on patterned Cu/Ta(N)/SiO_2 surfaces for super filling of sub-micron features

Author: Li W.H.   Ye J.H.   Li S.F.Y.  

Publisher: Springer Publishing Company

ISSN: 0021-891X

Source: Journal of Applied Electrochemistry, Vol.31, Iss.12, 2001-12, pp. : 1395-1397

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Abstract