Calculation of the current density distribution of submicron copper electroplating based on uneven adsorption of poly(ethylene glycol)

Author: Wu Bang-Hao   Wan Chi-Chao   Wang Yung-Yun  

Publisher: Springer Publishing Company

ISSN: 0021-891X

Source: Journal of Applied Electrochemistry, Vol.35, Iss.3, 2005-03, pp. : 305-310

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Abstract