Author： Touir R. Larhzil H. EbnTouhami M. Cherkaoui M. Chassaing E.
Publisher： Springer Publishing Company
ISSN： 0021-891X
Source： Journal of Applied Electrochemistry, Vol.36, Iss.1, 2006-01, pp. : 69-75
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Access to resources
Recommend
Electroless copper plating using Fe II as a reducing agent
By Sone M. Kobayakawa K. Saitou M. Sato Y.
Electrochimica Acta, Vol. 49, Iss. 2, 2004-01 ,pp. :
By Vaškelis A. Norkus E. SRC="/iso-ents/isolat2/edot-s.gif" ALT="edot" J.
![SRC="/iso-ents/isolat2/edot-s.gif" ALT="edot" J.](/index/search?type=2&isAccurate=1&searchValue="SRC="/iso-ents/isolat2/edot-s.gif" ALT="edot" J."){kind=link}
Journal of Applied Electrochemistry, Vol. 32, Iss. 3, 2002-03 ,pp. :