Modelling the creep rates of eutectic Bi–Sn solder using the data from its constitutive phases

Author： RAEDER C. H.   MITLIN D.   MESSLER   Jr R. W.  

Publisher： Springer Publishing Company

ISSN： 0022-2461

Source： Journal of Materials Science, Vol.33, Iss.18, 1998-09, pp. : 4503-4508

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